HHV Advanced Tech's Dual Ion Beam Sputtering Series

Dual ion beam configuration with primary gridded sputter source and assist/neutralizer source

High-vacuum architecture with turbo and cryo pump options for ≤1×10⁻⁷ mbar base pressure

4-target water-cooled carousel with auto-indexing for multilayer stacks

Substrate stage with rotation, tilt, and optional heating up to 250°C (higher-temperature options available)

Excellent thickness uniformity (typically ±2% over a 4-inch substrate)

Compact, robust chamber design with typical 500 × 500 × 500 mm process volume