Thin Film Equipment

Products / R&D

ALD Series

Fully-automated stand alone thermal atomic layer deposition (ALD) system can deposit pin-hole free films with extreme surface conformity. The system can accommodate wafer sizes of up to 6 inches in diameter and a gas manifold for up to six precursor lines.


    Fast pulse gas delivery valves with integrated purging
    893 mm x 1377 mm system footprint
    Comes with built-in recipes for Al2O3 and ZnO
    Basic version with two precursor lines
    Complete process automation with LabVIEW interface
    Dry pump option